Fabrication of 22-nm poly-silicon gate using resist shrink technologyIWAO, Fumiko; SHIMURA, Satoru; KAWASAKI, Tetsu et al.Proceedings of SPIE, the International Society for Optical Engineering. 2009, Vol 7273, issn 0277-786X, isbn 978-0-8194-7526-8 0-8194-7526-2, 72730G.1-72730G.5, 2Conference Paper

LWR reduction by novel lithographic and etch techniquesKOBAYASHI, Shinji; SHIMURA, Satoru; VALGIO PRET, Alessandro et al.Proceedings of SPIE, the International Society for Optical Engineering. 2010, Vol 7639, issn 0277-786X, isbn 978-0-8194-8053-8 0-8194-8053-3, 763914.1-763914.7, 2Conference Paper

Implementation of Double Patterning process toward 22-nm nodeYAEGASHI, Hidetami; NISIMURA, Eiichi; YABE, Kazuo et al.Proceedings of SPIE, the International Society for Optical Engineering. 2009, Vol 7520, issn 0277-786X, isbn 978-0-8194-7909-9 0-8194-7909-8, 75201E.1-75201E.9Conference Paper

Fine Trench Patterns with Double Patterning and Trench shrink TechnologySHIMURA, Satoru; KUSHIBIKI, Masato; KAWASAKI, Tetsu et al.Proceedings of SPIE, the International Society for Optical Engineering. 2009, Vol 7273, issn 0277-786X, isbn 978-0-8194-7526-8 0-8194-7526-2, 72730A.1-72730A.7, 2Conference Paper

Precise CD Control Techniques for Double Patterning and Sidewall TransferNISHIMURA, Eiichi; KUSHIBIKI, Masato; YATSUDA, Koichi et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, pp 692425.1-692425.8, issn 0277-786X, isbn 978-0-8194-7109-3Conference Paper

The Important Challenge to Extend Spacer DP process towards 22nm and beyondOYAMA, Kenichi; NISIMURA, Eiichi; YAMAJI, Tomohito et al.Proceedings of SPIE, the International Society for Optical Engineering. 2010, Vol 7639, issn 0277-786X, isbn 978-0-8194-8053-8 0-8194-8053-3, 763907.1-763907.6, 2Conference Paper

Fabrication of 32nm Contact/Via Hole by Photolithographic-friendly MethodKAWASAKI, Tetsu; SHIMURA, Satoru; IWAO, Fumiko et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, pp 692333.1-692333.7, issn 0277-786X, isbn 978-0-8194-7108-6Conference Paper

Fabrication of Contact/Via Holes for 32-nm Technology Device Using Cost-effective RIE CD Shrink Process and Double Patterning TechniqueKUSHIBIKI, Masato; NISHIMURA, Eiichi; YATSUDA, Koichi et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, pp 692426.1-692426.9, issn 0277-786X, isbn 978-0-8194-7109-3Conference Paper